ZALMAN ZM-STC11, Thermal paste

Description

ZALMAN ZM-STC11 thermal paste is designed to improve heat transfer between processors, heat sinks, and other cooling components to help maintain stable operating temperatures. The silicone-based compound uses zinc oxide and aluminum oxide fillers to create a consistent thermal interface, supporting reliable cooling performance and easy application. It is formulated to function across a wide temperature range and meets RoHS standards for material compliance.

• Enhances heat transfer between components for improved thermal management
• Works across a wide -40°C to 150°C operating range
• Silicone-based formula with zinc oxide and aluminum oxide fillers
• RoHS-compliant material composition

• Reliable thermal performance
  Delivers effective heat conduction to support consistent cooling, backed by a thermal conductivity of 18 W/mK.
• Wide temperature tolerance
  Maintains functionality from -40°C to 150°C to accommodate demanding operating conditions.
• Stable silicone formulation
  Polydimethylsiloxane base combined with zinc oxide and aluminum oxide provides a balanced consistency for straightforward application and durable thermal contact.
• Compliant material selection
  Manufactured to meet RoHS requirements, helping reduce exposure to restricted substances in electronic assemblies.

Main Specifications

Extended Specifications

General

Miscellaneous

Environmental Parameters