XPG LANCER BLADE, DDR5, kit, 32 GB: 2 x 16 GB, DIMM 288-pin low profile, 5600 MT/s / PC5-22400, CL46, 1.1, 1.4 V, unbuffered, on-die ECC, black

Description

The XPG LANCER BLADE memory kit delivers performance for gamers and content creators. With a total capacity of 32 GB across two 16 GB modules, it offers memory for demanding applications. Built with DDR5 SDRAM technology and compliant with PC5-22400 standards, this memory kit achieves a data transfer rate of 5600 MT/s, enabling quick data access and improved system responsiveness.
Featuring on-die ECC for enhanced data integrity, the XPG LANCER BLADE is designed to handle the rigorous demands of modern computing. It includes support for Intel Extreme Memory Profiles (XMP 3.0) and AMD EXPO, allowing for streamlined overclocking. The low-profile design, along with a built-in Power Management IC, optimizes performance while maintaining efficient power usage.

• Total capacity of 32 GB for multitasking
• Data transfer rate of 5600 MT/s for performance
• On-die ECC for data integrity
• Compatible with Intel XMP 3.0 and AMD EXPO
• Low-profile heatsink for cooling

• High capacity for multitasking
  The XPG LANCER BLADE memory kit includes two 16 GB modules, providing a total of 32 GB capacity. This capacity allows seamless multitasking across multiple applications, enhancing productivity and performance in memory-intensive tasks.
• Fast data transfer rate
  With a data transfer rate of 5600 MT/s, the DDR5 SDRAM technology in this memory kit ensures rapid data access. This speed translates into quicker load times and improved responsiveness, making it ideal for gaming and professional applications.
• Reliable data integrity
  The inclusion of on-die ECC technology enhances data integrity by automatically detecting and correcting memory errors. This feature ensures stability and reliability, which is crucial for workloads requiring consistent performance.
• Overclocking support
  Equipped with support for Intel Extreme Memory Profiles (XMP 3.0) and AMD EXPO, this memory kit allows users to easily boost performance through overclocking. This adaptability makes it a flexible choice for enthusiasts looking to maximize system performance.
• Efficient low-profile design
  The low-profile heatsink design contributes to efficient cooling and allows for easy installation in systems with space constraints. This feature enables compatibility with a variety of builds without compromising thermal performance.

Main Specifications

Extended Specifications

General

Memory

Miscellaneous